ECS 2021:The 13th International Conference on
Electronics and Communication Systems

Athens, Greece, February 28-30, 2021

About the Conference

All the papers of our Conferences will appear (after peer review) in ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals. 
The registration fees depend on the indexing of the particular Journal. We offer better APC (Article Processing Charges / Fees) than the Web Sites of these OA Journals, because we deliver them great numbers of papers. So, publish, via our Conferences, in highly reputable ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals and present your paper using Video Presentation in more than 1000 scholars each time. We can publish your paper as Chapter in Books of Springer because we are in collaboration with more than 30 Editors worldwide that collect papers in their Books at the moment. We can recommend you also publication in some other conferences that publish papers with IEEE in IEEEXplore or with Springer.


* Authors will be informed about the title of the Journal that can publish their paper before their registration. The authors are entitled to refuse the registration fees, if they do not agree with the journal.
* The Distribution of the articles to the various journals is completed by the Organizing, Steering and Program Committee based on the reviewers' comments.
* There are not any other additional fees for publication of your paper in these journals. The organizers pay for the publication of your paper(s) you using your registration fees. For this reason, in our conference the registration fees are per paper.
 

* Contact us by email: support@inase.org   Registration fees       Publication Ethics and Malpractice Statement     Deadlines

 

Paper Submission

Organizing Committee

  • Prof. Emmanuel Paspalakis, University of Patras, Patra, Greece
  • Prof. Dimitri Kazakos, Texas Southern University, USA
  • Prof. George Tsekouras, University of West Attica, Egaleo, Athens, Greece
  • Prof. James Lam, IEEE Fellow, IET Fellow, IMA Fellow, The University of Hong Kong, Hong Kong
  • Prof. Bimal Kumar Bose (Life Fellow IEEE), The University of Tennessee, Knoxville, USA
  • Prof. Narsingh Deo, IEEE Fellow, ACM Fellow, AAAS Fellow, ICA Fellow, Orlando, Florida, USA
  • Prof. Pierre Borne, ex IEEE France Section Chair, IEEE Fellow, IEEE/SMC Past President, Ecole Centrale de Lille, France
  • Prof. Wasfy B. Mikhael, IEEE Fellow, Vice President IEEE Circuits and Systems, University of Central Florida, Orlando, USA
  • Prof. Yuriy S. Shmaliy, IEEE Fellow, Universidad de Guanajuato, Mexico
  • Prof. Maria Isabel Garcia-Planas, Universitat Politecnica de Catalunya, Spain
  • Prof. Theodore B. Trafalis, University of Oklahoma, USA
  • Prof. Panagiotis Agathoklis, University of Victoria, British Columbia, Canada

Steering Committee

  • Prof. Kamisetty Rao, IEEE Fellow, University of Texas at Arlington, USA
  • Prof. D. Subbaram Naidu, IEEE Fellow, Idaho State University, USA
  • Prof. Tadeusz Kaczorek, IEEE Fellow, Warsaw University of Technology, Poland
  • Prof. Demetri Terzopoulos, IEEE Fellow, ACM Fellow, University of California, Los Angeles
  • Prof. Georgios B. Giannakis, IEEE Fellow, University of Minnesota, USA
  • Prof. Stamatios Kartalopoulos, IEEE Fellow, The University of Oklahoma, USA
  • Prof. Aggelos Katsaggelos, IEEE Fellow, Northwestern University, USA
  • Prof. Nikolaos Paragios, Ecole Centrale Paris, France
  • Prof. Nikolaos G. Bourbakis, IEEE Fellow, Wright State University, USA
  • Prof. Lei Xu, IEEE Fellow, Chinese University of Hong Kong, Hong Kong
  • Prof. Sidney Burrus, IEEE Fellow, Rice University, USA
  • Prof. Biswa N. Datta, IEEE Fellow, Northern Illinois University, USA
  • Prof. George Vachtsevanos, Georgia Institute of Technology, Atlanta, Georgia, USA
  • Prof. Jiri Hrebicek, Masaryk University, Brno, Czech Republic
  • Prof. Sorinel Oprisan, College of Charleston, Charleston, South Carolina, USA
  • Prof. Gen Qi Xu, Tianjin University, Tianjin, China
  • Prof. Humberto Varum, University of Aveiro, Aveiro, Portugal

Program Committee

  • Prof. Imre J. Rudas, Obuda University, Budapest, Hungary
  • Prof. Brett Nener, The University of Western Australia, Australia
  • Prof. Ronald Tetzlaff, Technical University Dresden, Germany
  • Prof. Peter Szolgay, Pazmany Peter Catholic University, Hungary
  • Prof. Xiang Bai, Huazhong University of Science and Technology, China
  • Prof. Alexander Gegov, University of Portsmouth, UK
  • Prof. Jan Awrejcewicz, Technical University of Lodz, Lodz, Poland
  • Prof. Carla Pinto, Polytechnic of Porto, Porto, Portugal
  • Prof. Hamid Reza Karimi, University of Agder, Grimstad, Norway
  • Prof. Hung-Yuan Chung, National Central University, Taiwan
  • Prof. Elbrous M. Jafarov, Istanbul Technical University, Istanbul, Turkey
  • Prof. Bosukonda Murali Mohan, Indian Institute of Technology Kharagpur, Kharagpur, India
  • Prof. Bharat Doshi, John Hopkins University, Mayrland, USA
  • Prof. Gang Yao, University of Illinois at Urbana - Champaign, USA
  • Prof. Lu Peng, Luisian State University, Baton Rouge, LA, USA
  • Prof. Pavel Loskot, Swansea University, UK
  • Prof. Abdullah Eroglu, Indiana University & Purdue University Fort Wayne (IPFW), USA
  • Prof. Francesco Zirilli, Sapinenza Universitat di Roma, Rome, Italy
  • Prof. Yoon-Ho Choi, Samsung Electronics Co. Ltd, South Korea
  • Prof. Winai Jaikla, KMITL University, Bangkok, Thailand
  • Prof. Ki Young Kim, Samsung Advanced Institute of Technology, Korea
  • Prof. Ryszard S. Choras, University of Technology & Life Sciences, Bydgoszcz, Poland
  • Prof. Hisashi Kobayashi, Princeton University, USA
  • Prof. Leonid Kazovsky, Stanford University, USA
  • Prof. Steven Collicott,Purdue University, West Lafayette, IN, USA
  • Prof. Stephen Weinstein, Columbia University, USA
  • Prof. Dharma P. Agrawal, University of Cincinnati, Cincinnati, OH, USA
  • Prof. Jose M. F. Moura, Carnegie Mellon University, Pittsburgh, PA, USA
  • Prof. Vijayakumar Bhagavatula (Fellow of OSA and SPIE), Carnegie Mellon University, Pittsburgh, PA, USA
  • Prof. Liang-Gee Chen, National Taiwan University, Taiwan
  • Prof. Ahmed H. Tewfik, University of Minnesota, USA
  • Prof. Jenq-Neng, Hwang University of WA, Seattle, USA
  • Prof. Amir Hussain, University of Stirling, Stirling, UK
  • Prof. Gergely V. Zaruba, The University of Texas at Arlington, USA
  • Prof. Mohammed Ghanbari, University of Essex, UK
  • Prof. C.-C. Jay Kuo, University of Southern California, USA
  • Prof. Amar Mukherjee, University of Central Florida, USA
  • Prof. Athanassios Manikas, Imperial College, University of London, UK
  • Prof. Dengsheng Zhang, Monash University, Australia
  • Prof. Xingquan Zhu, University of Vermont, VT, USA
  • Prof. Satnam Dlay, University of Newcastle upon Tyne, UK
  • Prof. Nicholas P. Karampetakis, Aristotle University of Thessaloniki, Thessaloniki, Greece
  • Prof. W. L. Woo, University of Newcastle upon Tyne, UK
  • Prof. Vyacheslav Tuzlukov, Kyungpook National University, South Korea
  • Prof. Stevan Berber, The University of Auckland, New Zeland
  • Prof. Alexander Zemliak, Autonomous University of Puebla, Mexico
  • Prof. Zoran Bojkovic, University of Belgrade, Serbia
  • Prof. Etsuji Tomita, The University of Electrocommunications, Japan
  • Prof. Lawrence Mazlack, University of Cincinnati, USA
  • Prof. Tomas Zelinka, Czech technical University in Prague, Czech Republic
  • Prof. Andrzej Chydzinski, Silesian University of Technology, Gliwice, Poland
  • Prof. Winai Jaikla, King Mongkut's Institute of Technology Ladkrabang, Thailand

Topics of Interest

Microelectronics: Device characterization and modeling, Device physics and novel structures, Materials and characterization techniques, Reliability and failure analysis, Radiation effects, Packaging, surface mount technology, Optoelectronics, MEMS and MOEMS devices, Smart power devices and sensors, Custom and semi-custom circuits, Interconnects, Embedded system design, Systems on Chip (SoCs), Reconfigurable chip design, Design for testability, Low-voltage, low-power VLSI design, ANN applications, Circuits for wireless communications, Modelling and simulation (process, device, circuit, logic, timing, functional), Trends in sub-micron technologies, Special microelectronic devices (magnetic memory, novel memory, imaging), Signal processing and multiplexing, DRAM, SRAM, flash high density, NVM, Logic/microprocessors, embedded logic, SiGe, GaN, and SiC devices, SOI, RF mixed analog/digital, Quantum computing, Microactuators, sensors and sensor networks, Biomimetic devices, Terahertz technology, System level verification,

Nanoelectronics:
Nanomaterial, Nanofabriction, Nanomeasurement, Nanodevice, Nanocircuit, Nanocharacterization, Advanced silicon devices and device physics, Nanotechnology for IC manufacturing, RF and mixed signal ICs, Noise behavior of MOS structures, Non-volatile memory technologies, Computational nanoelectronics, Particle simulation methods, Parameter extraction techniques, Interconnect modeling and algorithms, Modeling fabrication processes and equipment, Ballistic and quantum mechanical effects, Characterization and processing of new materials, Reliability of nanodevices and ESD design, Novel devies and post-CMOS silicon device structure, Key process technologies to integrate sub-100 nm Si ULSIs, Advanced physics in nanoelectronics analysis and synthesis, Physics and chemistry of surface and interface phenomena, Sub-100 nm silicon CMOS devices and their integration technologies, Process control, failure analysis, yield enhancements and modeling, Analytical methods and simulation algorithms for nanoelectronics, Advanced silicon circuits and systems, Advanced digital, analog, mixed-signal, and memory, Low power technologies and power aware systems, Integration of circuit and device simulation, Analog and digital circuits composed of nanodevices, System-level integration and packaging technologies, Chemical phenomena in the design of nanocircuits, Neural network, fuzzy logic, and multi-valued logic, Physical and circuit models of nanodevices and interconnects, Benchmarking, calibration, and verification of simulators, Integrated nanolelectronics and multifunction integrated circuits, Design, modeling, and simulation of nanoelectronic integrated circuits, Design and CAD technologies for the advanced packaging and system integration, Modeling and simulation of thermal, mechanical and electrical performance of packaging and system integration

Quantum Electronics: Spintronics, Quantum computing, Single electron devices, Nanotubes and nanostructures, Quantum phenomena in nanoscale, Dynamics of nanostructures, Quantum transport and quantum devices, Quantum wire, quantum well, and quantum dot, Wireless cellular automata, Hybrid micro-nanoelectronic logic, Heterostructures and superlattices, Compound semiconductor materials and devices, Self-assembly, nano and molecular scale devices, Spin and carrier control in quantum nanostructures, Ab-initio calculations of the electronic properties of nanostructures

Biomolecular Electronics: Molecular switches, Molecular electronics, Molecular manufacturing, Molecular electronic devices, Nanocomputing-nanocomputers, Functioning molecular wires, Inorganic nanowires and nanocrystals, Molecular electronic memory technology, Molecular computing-molecular computers, Circuit paradigm in molecular electronics, Organic semiconductor devices and materials, Electrical properties of organic thin film and materials, DNA computing, Biophysics, Biocomputing and biocomputers, User interfaces and visualization, Bioelectronics and bioinformatics, Biomedical and microfluidic applications, Biotechnologies in the design of nanocircuits, Biomedical engineering and biomedical electronics, Carrier transport in molecular and biological systems, Algorithms and biochips for DNA, healthcare and proteins, Micro-nano electromechanical devices for bio- and chemical applications, High performance computing, numerical methods and algorithms, including optimization, Computational methods and integrated systems for biochemical and medical applications,

Optoelectronics: Optical Fibers, Optical Cables, Optical Fiber Devices, Fabrication, installations, Fiber Bragg gratings, Lightwave circuits, Optical Fiber amplifiers and lasers, Optical Polymer fibers, Photonic crystal fibers and related topics, Optical Active Devices and Modules, Semiconductor lasers, detectors and their arrays, Light emitting devices, Semiconductor laser amplifiers, Waveguide laser amplifiers, Optoelectronic/photonic integrated circuits, Optical logics, memories and other functional devices, Related materials, device fabrication and device physics, Packaging and modules and related topics, Optical Passive Devices and Modules, Optical waveguide integrated devices/circuits; Planar, Optical isolators and circulators, Optical modulators and switches, Optical fiber-waveguide coupling, packaging and modules, Planar glass and polymer materials and device fabrication, Photonic crystals, Optical MEMS, Micro-optics and related topics, Optical Transmission Systems and Technologies, High speed optical transmissions, Wavelength division multiplexing, Ultra-long haul transmissions, Trans-oceanic systems, FTTx systems, Optical interconnection, Optical signal processing, Optical analog systems and related topics, Optoelectronic Networks and Applications, Optical networking, architectures, design and planning,

Communications: Microwave Theory and techniques, Applications of Microwaves in Biomedicine, Computational Methods for Microwaves Engineering, CAD design for Microwave Systems, Microwaves Circuits, Finite Differences, Finite Volumes, Finite Elements for Microwaves, Boundary Elements Method (BEM) applied in Microwaves problems, Antennas and Radars, Finite Differences, Finite Volumes, Finite Elements for Antennas, Boundary Elements Method (BEM) applied in Antennas problems, Lightwave technology, Submillimeter-Wave techniques, Microwave High-Power techniques, Microwave and millimeter-Wave Integrated Circuits, Microwave and millimeter-Wave Integrated Solid State Devices, Microwave Acoustics, Filter and Passive Components, Microwave and Antennas Measurements, Microwave Superconductivity, RFIC's, Wave-guides, Microwave propagation, Ferrites devices. Cavities. Microwave Circuits, Periodic Structures and Filters, Tubes, Masers, Amplifiers, HF-VHF-UHF Engineering, Antennas, Reflectors and Lens Antennas, Arrays, Scattering, Propagation, Diffraction, Electromagnetic Compatibility Problems, Applied Electromagnetics, Electromagnetic Field, Numerical Methods for Electromagnetics, Mathematical Methods and Computational techniques for Microwaves, Mathematical Methods and Computational techniques for Antennas and Radars, Radio Engineering applications in Astronomy, Navigation, Aerospace Systems, Low noise techniques, Optical Fiber Systems, Communication Electronics, Signal Processing for Wireless Communication., Communications Switching and Routing, Physical Layer, ISDN, Computer Networks, Architectural Aspects, ATM Networks, Protocols, Network Architecture, Network Reliability, Narrow band and Broad band Networks, Modern Routing Problems, Privacy and Security Problems, Queuing Theory and Communications, Traffic Problems, Wireless and Mobile Computing, Communication Systems Integration, Cryptology, Military Communications, Internet, Programming Techniques in Communications Networks, Simulation Techniques in Telecommunications, Software for Communications Development and Simulation, Social Implications of Modern Communications, Soft Computing and Communications, Smart Interfaces, Computer/Communications Integration, Education, Others...

Location and Venue

CONFERENCE GUIDE

About:     Athens, Greece     Map of  Athens     Photos from Athens     Conference Venue     How to get to Athens    Athens Travel Guide

Conference Publications

All the papers of our Conferences will appear (after peer review) in ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals. 
The registration fees depend on the indexing of the particular Journal. We offer better APC (Article Processing Charges / Fees) than the Web Sites of these OA Journals, because we deliver them great numbers of papers. So, publish, via our Conferences, in highly reputable ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals and present your paper using Video Presentation in more than 1000 scholars each time. We can publish your paper as Chapter in Books of Springer because we are in collaboration with more than 30 Editors worldwide that collect papers in their Books at the moment. We can recommend you also publication in some other conferences that publish papers with IEEE in IEEEXplore or with Springer.


* Authors will be informed about the title of the Journal that can publish their paper before their registration. The authors are entitled to refuse the registration fees, if they do not agree with the journal.
* The Distribution of the articles to the various journals is completed by the Organizing, Steering and Program Committee based on the reviewers' comments.
* There are not any other additional fees for publication of your paper in these journals. The organizers pay for the publication of your paper(s) you using your registration fees. For this reason, in our conference the registration fees are per paper.