CEMSA 2022:The 14th International Conference on
Chemical Engineering, Materials Science and Applications

Athens, Greece, June 26-28, 2022

About the Conference

All the papers of our Conferences will appear (after peer review) in ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals. 
The registration fees depend on the indexing of the particular Journal. We offer better APC (Article Processing Charges / Fees) than the Web Sites of these OA Journals, because we deliver them great numbers of papers. So, publish, via our Conferences, in highly reputable ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals and present your paper using Video Presentation in more than 1000 scholars each time. We can publish your paper as Chapter in Books of Springer because we are in collaboration with more than 30 Editors worldwide that collect papers in their Books at the moment. We can recommend you also publication in some other conferences that publish papers with IEEE in IEEEXplore or with Springer.


* Authors will be informed about the title of the Journal that can publish their paper before their registration. The authors are entitled to refuse the registration fees, if they do not agree with the journal.
* The Distribution of the articles to the various journals is completed by the Organizing, Steering and Program Committee based on the reviewers' comments.
* There are not any other additional fees for publication of your paper in these journals. The organizers pay for the publication of your paper(s) you using your registration fees. For this reason, in our conference the registration fees are per paper.
 

* Contact us by email: support@inase.org   Registration fees       Publication Ethics and Malpractice Statement     Deadlines

 

Paper Submission

Papers must be written in the correct format:  MS Word.doc  or LaTeX  or LaTeX2   and must be uploaded using the following form as .doc, or .pdf file. Invited and Regular Papers will be published in various Indexed Journals based on quality and reviewers' recommendations. Only full papers will be promoted to reviewers for thorough peer review.


Click here for Submission


 

Organizing Committee

  • Prof. Charles A. Long, Professor Emeritus at University of Wisconsin, Stevens Point, Wisconsin, USA
  • Prof. Igor Neelov, Head of International Laboratory, Institute of Bioengineering, ITMO University, Russia
  • Prof. Antoanela Naaji, Vasile Goldis Western University of Arad, Arad, Romania,
  • Prof. Manijeh Razeghi, Center for Quantum Devices, EECS Dept., Northwestern University, Illinois, USA
  • Prof. Amit Bandyopadhyay, AAAS, ASM, AIMBE, ACerS Fellow, Washington State University, USA
  • Prof. Yong Ding, Georgia Institute of Technology, Atlanta, GA, USA

Steering Committee

  • Prof. Aida Bulucea, University of Craiova, Romania
  • Prof. Yulin Deng, Georgia Institute of Technology, Atlanta, GA, USA
  • Prof. Paul H. Holloway, Distinguished Professor, University of Florida, Gainesville FL, USA
  • Prof. Saad Khan, North Carolina State University, Raleigh, North Carolina, USA
  • Prof. Igor Sevostianov, New Mexico State University, Las Cruces, New Mexico, USA
  • Prof. Mohindar S. Seehra, West Virginia University, Morgantown, West Virginia, USA

Program Committee

  • Prof. Tao Liu, Florida State University, Tallahassee, Florida, USA
  • Prof. Samuel Lofland, Rowan University, Glassboro, New Jersey, USA
  • Prof. Daniel Guay, Institut National de la Recherche Scientifique (INRS), Universite du Quebec,Quebec, Canada
  • Prof. Tian Tang, University of Alberta, Edmonton, Alberta, Canada
  • Prof. Roland Frankenberger, University of Marburg, Marburg, Germany
  • Prof. Mohamedally Kurmoo, Universite de Strasbourg, Strasbourg, France
  • Prof. C. C. Sorrell, University of New South Wales, Sydney, NSW, Australia
  • Prof. Concepcion Lopez, Universitat de Barcelona, Barcelona, Spain
  • Prof. Alan Dalton, University of Surrey, Guildford, Surrey, UK
  • Prof. Kourosh Kalantar-Zadeh, RMIT University, Melbourne, Australia
  • Prof. Tetsu Yonezawa, Hokkaido University, Kita Ward, Sapporo, Hokkaido Prefecture, Japan
  • Prof. Daolun Chen, Ryerson University, Toronto, Ontario, Canada
  • Prof. Mohamed M. Chehimi, Universite Paris Diderot, Paris, France
  • Prof. Vincenzo Fiorentini, Universita degli studi di Cagliari, Cagliari, Italy
  • Prof. Tamas Ungar, Eotvos Lorand University (ELTE), Budapest, Hungary
  • Prof. Anthony W. Coleman, Universite Claude Bernard Lyon 1, Lyon, France
  • Prof. Albert Chin, IEEE Fellow, OSA Fellow, National Chiao Tung University, Hsinchu, Taiwan
  • Prof. Artur Cavaco-Paulo, Universidade do Minho, Braga, Portugal
  • Prof. Yoshihiro Tomita, Kobe University, Kobe, Japan
  • Prof. Jian Wang, Los Alamos National Laboratory, Los Alamos, NM, USA
  • Prof. Byung K. Kim, Pusan National University, Busan, South Korea
  • Prof. John T. Sheridan, University College Dublin, Belfield, Dublin, Ireland
  • Prof. Chi-Wai Chow, National Chiao Tung University, Hsinchu, Taiwan
  • Prof. Christian M. Julien, Universite Paris-6, Paris, France
  • Prof. Chun-Hway Hsueh, National Taiwan University, Taipei, Taiwan
  • Prof. Luigi Nicolais, Universita Degli Studi di Napoli Federico II, Napoli, Italy
  • Prof. Hyung-Ho Park, Yonsei University, Seodaemun-gu, Seoul, Korea
  • Prof. Victor M. Castano, Universidad Nacional Autonoma de Mexico, Mexioc City, Mexico
  • Prof. Peter Chang, University of Saskatchewan, Saskatoon, Saskatchewan, Canada
  • Prof. Dean-Mo Liu, National Chiao Tung University, HsinChu, Taiwan
  • Prof. Rui Vilar, Instituto Superior Tecnico, Lisboa, Portugal
  • Prof. Hugh J. Byrne, Dublin Institute of Technology, Dublin, Ireland
  • Prof. Won-Chun Oh, Hanseo University, Seosan-si, Chungcheongnam-do, South Korea
  • Prof. Yuanhua Lin, Tsinghua University, Haidian, Beijing, China
  • Prof. S.C. Tjong, City University of Hong Kong, Sham Shui Po District,New Kowloon, Hong Kong
  • Prof. Huan-Tsung Chang, National Taiwan University, Taipei City, Taiwan
  • Prof. Yoshitake Masuda, National Institute of Advanced Industrial Science and Technology (AIST), Tokyo, Japan
  • Prof. Jing Zhang, Donghua University, Shanghai, China
  • Prof. Veronica Cortes de Zea Bermudez, Universidade de Tras-os-Montes e Alto Douro, Vila Real, Portugal
  • Prof. Jun Zhang, Inner Mongolia University, Hohhot, Inner Mongolia, China
  • Prof. Israel Felner, Hebrew University of Jerusalem, Jerusalem, Israel
  • Prof. Sukhvinder Badwal, CSIRO Energy Technology, Australia
  • Prof. Te-Hua Fang, National Kaohsiung University of Applied Sciences (KUAS), Kaohsiung, Taiwan
  • Prof. Belkheir Hammouti, Mohammed Premier University, Oujda, Morocco
  • Prof. Mohd Sapuan Salit, Universiti Putra Malaysia, Selangor, Malaysia
  • Prof. Kwansoo Chung, Seoul National University, Seoul, South Korea
  • Prof. Zhongfang Chen, University of Puerto Rico, San Juan, Puerto Rico
  • Prof. Soon-Ku Hong, Chungnam National University, Daejeon, South Korea
  • Prof. Hannes Jonsson, University of Iceland, Reykjavik, Iceland
  • Prof. Culea Eugen, Technical University of Cluj-Napoca, Cluj-Napoca, Romania
  • Prof. Vesselin Dimitrov, University of Chemical Technology and Metallurgy, Sofia, Bulgaria

Topics of Interest

CHEMICAL ENGINEERING: Reaction engineering, catalysis and kinetics, Distillation and absorption, Extraction and leaching, Membrane separations, Adsorption and ion exchange, Filtration, sedimentation, centrifugation, hydrocyclons, Phase equilibrium and fluid properties, Fluid flow and multiphase systems, Mixing, Fluidization, Heat transfer processes and equipment, Drying and evaporation, Computer aided process engineering, Particulate solids, Pharmaceutical engineering, Environmental engineering, Electrochemical engineering, Safety in chemical industry, Supercritical fluid applications, Thermodynamics and transport properties, Food processing and technology, Micro- and mesoporous materials, Biotechnology, Process intensification and miniaturisation, Electromembrane processes and integrated membrane systems, Analytical Chemistry, Advanced materials processing, Biochemical and bio-molecular engineering, Bioengineering and biomedical engineering, Biological and Medicinal Chemistry, Biotechnology, Catalysis, Chemical Education, Chemical engineering education, Chemical reaction engineering, Chemical engineering equipment design and process design, Economics and Business Management, Environment, Inorganic Chemistry, Macromolecular Science and Engineering, Materials Chemistry, Organic Chemistry, Physical, Theoretical and Computational Chemistry, Process Safety Management, Rubber, Surface Science, Systems and Control, Green Chemistry Forum, Energy and environment, Food process technology and engineering, Forest product processing, Milk product processing, Industrial collaboration, Industrial drying, Mining and metals, Nanomaterials, Particle technology, Process system, instrumentation and control, Product engineering and product development, Separation and purification, Transport phenomena (heat, mass transfer and fluid flows), Mathematical modeling in chemical engineering, Chemical engineering education, Others....

MATERIAL SCIENCE: Inorganic Materials, Metallic Materials, Organic Materials, Composite Materials, Polymer Materials, Biomaterials, Nanomaterials, Macroscopic Properties of Materials, Failure Analysis, Strength of Materials, Condensed Matter Physics, Materials Physics, Ceramography, Crystallography, Electronic and Magnetic Materials, Semiconductors, Thin Films, Refractory Materials, Functionally Graded Materials, Materials in Industry, Ceramics and Glasses, Metal Alloys, Forensic Materials Engineering, Metallography, Metallurgy, Microtechnology, Nanotechnology, Rheology, Surface Science/Catalysis, Textile Reinforced Materials, Tribology, OthersOthers ...

Location and Venue

CONFERENCE GUIDE

About:     Athens, Greece     Map of  Athens     Photos from Athens     Conference Venue     How to get to Athens    Athens Travel Guide

Conference Publications

All the papers of our Conferences will appear (after peer review) in ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals. 
The registration fees depend on the indexing of the particular Journal. We offer better APC (Article Processing Charges / Fees) than the Web Sites of these OA Journals, because we deliver them great numbers of papers. So, publish, via our Conferences, in highly reputable ISI/SCOPUS/EI Compendex/IET (Inspec)/Google Scholar indexed Journals and present your paper using Video Presentation in more than 1000 scholars each time. We can publish your paper as Chapter in Books of Springer because we are in collaboration with more than 30 Editors worldwide that collect papers in their Books at the moment. We can recommend you also publication in some other conferences that publish papers with IEEE in IEEEXplore or with Springer.


* Authors will be informed about the title of the Journal that can publish their paper before their registration. The authors are entitled to refuse the registration fees, if they do not agree with the journal.
* The Distribution of the articles to the various journals is completed by the Organizing, Steering and Program Committee based on the reviewers' comments.
* There are not any other additional fees for publication of your paper in these journals. The organizers pay for the publication of your paper(s) you using your registration fees. For this reason, in our conference the registration fees are per paper.