INASE Conferences

The Best Experience
 

After the INASE conference, authors of the Presented Articles will be able to send their Extended Versions in several special Issues of MDPI (Editor: Prof. Nikos Mastorakis)
1.https://www.mdpi.com/journal/symmetry/special_issues/Simulation_Modelling_Natural_Sciences_Biomedicine_Engineering_2022
2.https://www.mdpi.com/journal/sustainability/special_issues/EES
Note that only presented articles in INASE Conferences will have this privilege with a discount fee of around 35%




   Puerto De La Cruz, Tenerife, Canary Islands, Spain, January 27-29, 2024




  Puerto De La Cruz, Tenerife, Canary Islands, Spain, January 27-29, 2024




  Barcelona, Spain, January 30- February 1, 2024




  Barcelona, Spain, January 30- February 1, 2024




  Bern, Switzerland, February 24-26, 2024




   Bern, Switzerland, February 24-26, 2024




  Rome, Italy, March 23-25, 2024




  Rome, Italy, March 23-25, 2024




  Rome, Italy, March 23-25, 2024




   London, UK, April 29 - May 1, 2024




  London, UK, April 29 - May 1, 2024




   London, UK, April 29 - May 1, 2024




  Ierapetra Beach, Crete Island, Greece, May 7-9, 2024




   Ierapetra Beach, Crete Island, Greece, May 7-9, 2024




   Ierapetra Beach, Crete Island, Greece, May 7-9, 2024




  Marathon Beach, Athens, Greece, June 1-3, 2024




  Marathon Beach, Athens, Greece, June 1-3, 2024




    Rome, Italy, June 20-22, 2024



  Rome, Italy, June 20-22, 2024





  Bern, Switzerland, June 27-30, 2024




  Bern, Switzerland, June 27-30, 2024




  Bern, Switzerland, June 27-30, 2024





   Ierapetra Beach, Crete Island, Greece, July 19-22, 2024




  Ierapetra Beach, Crete Island, Greece, July 19-22, 2024




  Ierapetra Beach, Crete Island, Greece, July 19-22, 2024




   Agios Nikolaos, Crete Island, Greece. August 19-21, 2024




  Agios Nikolaos, Crete Island, Greece. August 19-21, 2024





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Full Papers are published in journals indexed in ISI (Web of Science), EI Compendex, Scopus, GoogleScholar, Copernicus, ProQuest, EBSCO, IET, DBLP, ACM etc as well as in some IEEE Proceedings, IOP, AIP, Springer Verlag. Contact us for details.